| 摘要 |
An inspection device is configured having: an illumination unit that illuminates a wafer with illumination light having a plurality of kinds of wavelengths; a photographing unit that photographs the image of the wafer illuminated with the illumination light; and an image processing unit that generates an inspection image of the wafer photographed by the photographing unit, by performing a predetermined weighting for each of the plurality of kinds of wavelengths, and judges whether any defect is present in the wafer based on the generated inspection image.
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