| 发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST, AND METHOD OF MANUFACTURE THEREOF |
| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
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| 申请公布号 |
US2009315170(A1) |
申请公布日期 |
2009.12.24 |
| 申请号 |
US20090473233 |
申请日期 |
2009.05.27 |
| 申请人 |
SHIM IL KWON;CHOW SENG GUAN;KUAN HEAP HOE;YOON SEUNG UK;HA JONG-WOO |
发明人 |
SHIM IL KWON;CHOW SENG GUAN;KUAN HEAP HOE;YOON SEUNG UK;HA JONG-WOO |
| 分类号 |
H01L23/50;H01L21/50;H01L21/56;H01L21/98 |
主分类号 |
H01L23/50 |
| 代理机构 |
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