| 发明名称 |
Semiconductor chip assembly |
| 摘要 |
A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.
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| 申请公布号 |
US2009315172(A1) |
申请公布日期 |
2009.12.24 |
| 申请号 |
US20080213754 |
申请日期 |
2008.06.24 |
| 申请人 |
|
发明人 |
LIM FONG;LEE SEE YAU;HENG YANG HONG |
| 分类号 |
H01L21/50;H01L23/34 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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