| 摘要 |
Disclosed are a probe card assembly and test probes used therein. The probe card assembly includes a main body, a probe base provided at a center of the main body, and a plurality of test probes connecting the main body and the probe base. Therein, each of the test probes has a tip extending out from the probe base for contacting and testing a wafer. The test probes include at least one power probe, at least one grounding probe and a plurality of signal probes, wherein each of the test probes has a middle section between the main body and contains therein a core that is wrapped by an insulation layer.
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