发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent an erroneous operation of an ROM by forming a conductive film on the inside of a cover making contact with the upper surface of a package cover and extending to be connected to a grounding lead wire. CONSTITUTION:A cover 10 of heat resistant and corrosion resistant plastic is formed in box shape, and is coated on the package 2. A conductive film 11 is formed on the entire surface of contacted surface of the lid 3 with the cover 10, and the film 11 is connected to the conductive film 12 of part of the inside wall of the cover 10. When the cover 10 is placed on ROM8, the film 12 makes contact only with the grounding lead wire 9. After predetermined wiring, the cover 10 is placed on the package 2 for shipment. Since the charge generated on the cap 3 is not accumulated on the cap, no erroneous operation is conducted to improve the reliability. Since the cover operates in high heat resistance and corrosion resistance as sufficient ultraviolet ray shield in an atmosphere wherein an ROM is used, the content of the storage does not alter to improve the reliability of the ROM.
申请公布号 JPS5623754(A) 申请公布日期 1981.03.06
申请号 JP19790097285 申请日期 1979.08.01
申请人 HITACHI LTD 发明人 KIHARA TOSHIMASA
分类号 H01L23/02;H01L21/8247;H01L23/50;H01L23/552;H01L23/58;H01L29/788;H01L29/792 主分类号 H01L23/02
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