SOLID-STATE IMAGE PICKUP DEVICE

摘要

A solid state image pickup device (1) is equipped with a semiconductor substrate (3A), which possesses a pixel array (10A) comprising pixels arranged in M rows and NA columns, a semiconductor substrate (3B), which possesses a pixel array (10B) comprising pixels arranged in M rows and NB columns, with the first column thereof arranged along the NA column of the pixel array (10A), and a signal output unit (20). The signal output unit (20) outputs digital values corresponding to each column from the first column to the nth column (2 = n < NA) of the pixel array (10A) sequentially from the nth column to the first column and, parallel with this output, sequentially outputs digital values corresponding to each column from the (n+1)th column of the pixel array (10A) to the NBth column of the pixel array (10B) in the reverse order from the first column through the nth column of the pixel array (10A). Thus, the time required for image pickup of one frame is shortened in a solid-state image pickup device equipped with a configuration in which the various pixel arrays, formed on two substrates, are tiled in the line direction.