COLLECTIVE CERAMIC SUBSTRATE, MANUFACTURING METHOD FOR THE SUBSTRATE, CERAMIC SUBSTRATE, AND CERAMIC CIRCUIT SUBSTRATE

摘要

Provided is a collective ceramic substrate which has dividability wherein the substrate can be excellently divided when intended and cannot be easily divided by mistake when unintended.  Further provided are a ceramic substrate excellent in dimensional precision and flexural strength, and a ceramic circuit substrate excellent in dielectric strength.  The collective ceramic substrate is provided with continuous grooves for dividing, which are for multiple circuit substrates, in one or two faces of a fired ceramic substrate by a laser-beam machining operation.  At least one continuous groove of the collective ceramic substrate has a groove depth difference (?d), as taken in the longitudinal direction of the grooves, between the deepest portion and the shallowest portion is 10 µm = ?d = 50 µm.  In the ceramic substrate divided from the collective ceramic substrate, for example, at least one side face is formed by dividing the same along the continuous grooves.  In arithmetic mean roughness (Ra) of the side face, the arithmetic average roughness (Ra2) of the continuous groove worked surface is smaller than the arithmetic average surface roughness (Ra1) of the broken portion surface.