发明名称 HEAT PIPE, A DISTRIBUTION SUPPLY STRUCTURE USED AS HEAT TRANSFER MEDIUM AND AN UNDERFLOOR HEATING DEVICE
摘要 <p>A distribution supply structure used as a heat transfer medium according to the invention comprises: a plurality of heat conductors which are arranged transversely underneath the indoor floor and can be filled with heat transfer media; and a distribution pipe which is connected by the medium of connection means to an end of the thermal conductor in such a way as to be able to communicate therewith and has a through hole formed inside to be filled with the heat transfer medium and a heat generator positioned close to the through hole and filled with a heat medium.  Accordingly, the invention has useful effects on the improvement of heat transfer efficiency as it quickly distributes and supplies a heat transfer medium into a plurality of heat conductors using one pipe being laid, and demonstrates a high heat diffusion rate of the heat medium which is a fluid filled inside the heat generator, with the heat generator being disposed inside the distribution pipe.</p>
申请公布号 WO2009131412(A3) 申请公布日期 2009.12.23
申请号 WO2009KR02159 申请日期 2009.04.24
申请人 CHOI, YOUNGKIL 发明人 CHOI, YOUNGKIL
分类号 F28D15/02 主分类号 F28D15/02
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