发明名称 Heat dissipating device
摘要 A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is received in the first groove, and an electronic component is received in the second groove.
申请公布号 US7636241(B2) 申请公布日期 2009.12.22
申请号 US20070957502 申请日期 2007.12.17
申请人 HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 LIU CHANG-CHUN;GAN XIAO-LIN;HO YU-KUANG
分类号 H05K7/20;F28F7/00;H01L23/34 主分类号 H05K7/20
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