| 摘要 |
A method of patterning a substrate that includes mechanically locating a first masking film over the substrate; segmenting the first masking film into a first masking portion and first contiguous opening portions in first locations; mechanically removing the one or more first contiguous opening portions; depositing first materials over the substrate in the first locations to form first patterned areas; mechanically locating a second masking film over the substrate and first masking portions; segmenting the second masking film and first masking portion into a second masking portion and second contiguous opening portions, wherein the second contiguous opening portions are in second locations over the substrate, yet different from the first locations; mechanically removing the second contiguous opening portions; and depositing second materials over the substrate in the second locations to form second patterned areas.
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