| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming an image by a thick film, reducing water absorption property sufficiently, and being favorably used in the application of an interlayer insulation film or the like. <P>SOLUTION: This photosensitive resin composition contains (A) polyamic acid having a 5-20C alkylene chain or alicyclic skeleton in a main chain, (B) a photopolymerizable compound having an epoxy resin containing a vinyl group, and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2010,JPO&INPIT |
