发明名称 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a transparent flexible printed circuit board that secures transparency while securing adhesive strength between a conductive metal foil and a resin material without using any adhesive, and a flexible printed circuit board which is superior in strength and size stability and a method of manufacturing the same. Ž<P>SOLUTION: A first polymeric resin material 12 which is transparent when cured is laminated on a roughened surface 13a of the conductive metal foil 13 through anchor effect and the conductive metal foil is etched after the first polymeric resin material is cured to form a laminate having a predetermined circuit pattern 31. A roughened surface of the laminate where the conductive metal foil 13 is removed is coated with a second polymeric resin material 32 which is transparent when cured, to make the flexible printed circuit board transparent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009295874(A) 申请公布日期 2009.12.17
申请号 JP20080149573 申请日期 2008.06.06
申请人 SHIRAI ELECTRONICS INDUSTRIAL CO LTD 发明人 OKADA KOICHI;HASHIMOTO SATOSHI;MOCHIZUKI RYOTA
分类号 H05K3/28;H05K1/03 主分类号 H05K3/28
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