| 摘要 |
PROBLEM TO BE SOLVED: To provide a polymer for sealing an optical semiconductor for giving a cured product, which causes no separation and the like from a package base material even in a high-temperature condition such as a reflow soldering process and has both of sufficient curability and crack resistance even when it is formed to have film thickness on the order of mm, and to provide a method for producing the polymer for sealing optical semiconductor. SOLUTION: The method for producing the polymer, which has weight-average molecular weight of 1,000-100,000, for sealing an optical semiconductor includes the following processes (i) and (ii). In the process (i), an epoxy group-containing alkoxysilane (A) having specific structure and a hydroxy-terminal polydimethylsiloxane (B) having a weight-average molecular weight of 1,000-20,000 are reacted with each other in the presence of a basic compound or a metal chelate compound. In the process (ii), a product obtained in the process (i) is reacted with water in the presence of the basic compound or the metal chelate compound. COPYRIGHT: (C)2010,JPO&INPIT
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