| 摘要 |
<p>Provided are a mounting substrate wherein high reliability is ensured, a substrate and methods for manufacturing the mounting substrate and the substrate. The mounting substrate is provided with a substrate (2) whereupon an electrode pad (4) is formed; a first insulating layer (8) formed on the substrate (2) including the electrode pad (4); a stress relaxing layer (9), which is formed on the first insulating layer (8) and has an elastic modulus lower than that of the first insulating layer (8); an opening section, which is formed on the first insulating layer (8) and the stress relaxing layer (9), and connected to the electrode pad (4); a conductive adhesive (6) applied in the opening section and contains conductive particles and a resin; and a metal layer (7) formed on the surface of the conductive adhesive (6). An interface between the first insulating layer (8) and a stress relaxing layer (9) is brought into contact with the conductive adhesive (6) in the opening section (region (a)). The conductive adhesive (6) has the conductive particles protruded from the outermost layer of the resin on the surface layer section of the conductive adhesive (6) in contact with the metal layer (7). The metal layer (7) is directly adhered on the conductive particles without having the resin in between.</p> |
