发明名称 ETCHING LIQUID MANAGEMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To make the hydrogen peroxide concentration of an etching liquid more constant in an etching liquid management device. Ž<P>SOLUTION: The etching liquid management device 10 managing an etching liquid 11 comprising a hydrogen peroxide solution and a copper-dissolved liquid having a specific gravity higher than that of the hydrogen peroxide solution and in which copper is dissolved is provided with: an etching liquid management tank 12; etching liquid piping 52 carrying the etching liquid; a hydrogen peroxide solution vessel 40 storing a hydrogen peroxide solution for supply supplied to the etching liquid; and hydrogen peroxide solution piping 42 carrying the hydrogen peroxide solution for supply. The device includes: a double pipe 54 having an inner pipe 58 in which the etching liquid piping is connected to the upper edge in the vertical direction and through which the etching liquid flows and an outer pipe 60 into which the inner pipe is inserted, in which the hydrogen peroxide solution piping is connected to the outer circumferential face and through which the hydrogen peroxide solution for supply flows; and joining piping 56 connected to the lower edge in the vertical direction of the outer pipe and carrying a joined liquid in which the etching liquid flowing through the inner pipe and the hydrogen peroxide solution for supply flowing through the outer pipe are joined to the etching liquid management tank. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009293060(A) 申请公布日期 2009.12.17
申请号 JP20080145425 申请日期 2008.06.03
申请人 FUJIKURA LTD 发明人 FUJII KOICHI;MATSUURA TAKAAKI
分类号 C23F1/08;C23F1/18 主分类号 C23F1/08
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