| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce evacuation time when closing a vacuum chamber for evacuation and bonding upper and lower substrates, in a substrate bonding apparatus and method. Ž<P>SOLUTION: In the substrate bonding method, dry air is supplied to a vacuum chamber 11 during the following period, from before opening the vacuum chamber 11 after starting the bonding of the upper and lower substrates 1 and 2 by evacuating the inside of a vacuum chamber 11 using an evacuation device 40 while the vacuum chamber 11 is closed, until the time when opening the vacuum chamber 11 again for transporting the bonded upper and lower substrates 1, 2 to the outside of the vacuum chamber 11, carrying new upper and lower substrates 1, 2 into the vacuum chamber 11, closing the vacuum chamber 11 again, evacuating the inside of the vacuum chamber 11 by the evacuation device 40, and bonding the new upper and lower substrates 1, 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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