| 摘要 |
The heat sink include a conductive heat dissipation portion for dissipating heat of an electronic component into the air, and a current limitation portion arranged on the heat dissipation surface of the heat dissipation portion and limiting a discharge current flowing between a material object located in proximity to the heat dissipation surface and the heat dissipation portion when discharge phenomenon takes place between the material object and the heat dissipation portion.
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