HEAT RADIATION STRUCTURE OF ELECTRONIC DEVICE

摘要

<P>PROBLEM TO BE SOLVED: To easily exchange a card in an electronic device in which a heat generating electronic component connected to a heat sink mounted on a mother board is mounted on a card removably mounted on the mother board. Ž<P>SOLUTION: The card 6 mounted with the heat generating electronic component 5 is detachably connected to the mother board 4 through a connector. The heat generating electronic component 5 is connected to the heat sink 9 through a heat receiving block 8 and a heat conducting member 12. The heat sink 9 and the card 6 are fixed on a plate-like support member 13 detachably mounted on the mother board 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž