| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise a manufacturing yield of MEMS by solving problems that the manufacturing yield drops in a process of cutting by a dicer, since a large force is applied to a glass wafer, and that the glass wafer is apt to be broken in handling, when a deep groove is formed beforehand so as to reduce the force applied to the glass wafer in a process of cutting along the groove. Ž<P>SOLUTION: A manufacturing method of MEMS includes processes wherein a plurality of grooves not being uniform in the depth are formed in a first plate-shaped component and the first plate-shaped component and a second plate-shaped component are joined together, and wherein the first plate-shaped component is cut along the relatively shallow grooves and then cut along the relatively deep grooves and thereby a structural element having the second plate-shaped component joined is formed out of a divided part of the first plate-shaped component. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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