| 摘要 |
A power semiconductor arrangement including a clamping device including a first clamping element and a second clamping element. A plurality of power semiconductor elements are stacked on each other between the first and second clamping elements of the clamping device. The first clamping element receives a clamping force in an axial direction of the stack of the power semiconductor elements. At least one spring element is arranged between the first clamping element and the power semiconductor elements. The at least one spring element presents at least one support surface with which the at least one spring element bears against at least one corresponding support surface of an adjacent element. The at least one spring element includes a helical spring. A center axis of the at least one spring element coincides with a center of the clamping force, or the at least one spring element includes a plurality of helical springs arranged in parallel with each other, which are arranged symmetrically in relation to a point in which a center of the clamping force is introduced into the first clamping element. |
