| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, although the exemplary composite multilayer substrate used in a conventional high-frequency semiconductor device is so constituted as to join the rear surface of a ceramic substrate to the composite resin material layer comprising an epoxy resin and an inorganic filler, since the ceramic substrate and the composite resin material layer are joined to each other via a resin material, the force whereby the ceramic substrate and the composite resin material layer are joined to each other has been so weak that the ceramic substrate and the composite resin material layer are stripped from each other by such an external force as the impact force generated when dropping them. SOLUTION: A composite multilayer substrate 1 so has a ceramic multilayer substrate 2 and so has a resin layer 3 as to join the ceramic multilayer substrate 2 to the resin layer 3. The ceramic multilayer substrate 2 so has a circuit pattern 4 and the resin layer 3 so has via-hole conductors 6 and so has external terminal electrodes 7 that the circuit pattern 4 and the external terminal electrodes 7 are connected by the via-hole conductors 6. A junction reinforcing member 8 for reinforcing the force whereby the ceramic multilayer substrate 2 and the resin layer 3 are joined to each other is provided along the direction of both 2, 3 being laminated therein. COPYRIGHT: (C)2005,JPO&NCIPI |
