发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 Through holes (36E) for ground and through holes (36P) for power supply are arranged in a lattice form on a core board (30) so that electromotive forces induced in the X direction and the Y direction are canceled. Mutual inductance is thereby decreased and an erroneous operation and an error are prevented even if a high frequency IC chip is mounted. Consequently, electrical characteristics and reliability can be enhanced.
申请公布号 KR20090128578(A) 申请公布日期 2009.12.15
申请号 KR20097024850 申请日期 2004.04.06
申请人 IBIDEN CO., LTD. 发明人 KATO SHINOBU
分类号 H05K3/46;H01L23/498;H01L23/50;H05K3/42 主分类号 H05K3/46
代理机构 代理人
主权项
地址