发明名称 |
CHEMISCH-MECHANISCHE POLIERKOPFVORRICHTUNG MIT EINEM SCHWIMMENDEN WAFERHALTERING UND WAFERTRÄGER MIT MEHRZONIGER POLIERDRUCKSTEUERUNG |
摘要 |
<p>The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity. A method for polisihing and a semiconductor manufacture is also provided.</p> |
申请公布号 |
AT450345(T) |
申请公布日期 |
2009.12.15 |
申请号 |
AT20070011957T |
申请日期 |
2000.02.24 |
申请人 |
EBARA CORPORATION |
发明人 |
WANG, HUEY-MING;MOLONEY, GERARD S.;CHIN, SCOTT;GERAGHITY, JOH J.;DYSON, WILLIAM;DICKEY, TANLIN |
分类号 |
B24B37/30;B24B37/32;B24B49/16;B24B53/007 |
主分类号 |
B24B37/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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