发明名称 |
NON-SOLVENT TYPE CONDUCTIVE PASTE COMPOSITION AND PREPARATION OF ELECTRODE USING THE SAME |
摘要 |
PURPOSE: A non-solvent type conductive paste composition is provided to reduce production time and equipment of an electrode by allowing a drying process to be omitted, and to prevent the collapse after the plasticity of the electrode. CONSTITUTION: A non-solvent type conductive paste composition comprises 5~30 weight% polyfunctional monomer or oligomer, 60~90 weight% conductive metal material, 1~10 weight% glass frit, and 0.1~5 weight% photoinitiator. A method for manufacturing an electrode comprises the steps of: printing the conductive paste composition on a substrate; selectively exposing the printed electrode paste to ultraviolet rays using a photomask; patterning the pasted by developing the exposed electrode paste; and plasticizing the patterned electrode paste to form an electrode. |
申请公布号 |
KR20090128082(A) |
申请公布日期 |
2009.12.15 |
申请号 |
KR20080054087 |
申请日期 |
2008.06.10 |
申请人 |
SSCP CO., LTD. |
发明人 |
KIM, HWA JOONG;JUN, TAE HYUN;SONG, HA CHUL;RYU, EUN KYOUNG |
分类号 |
H01B1/20;H01B1/14;H01L31/04 |
主分类号 |
H01B1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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