| 摘要 |
PURPOSE: A semiconductor laser diode package is provided to prevent the separation of a light emitting device and intermediate member by using a combining aperture and a terminal pin. CONSTITUTION: The heat sink(10) is composed of the metal plate. The guide groove is formed in the front of the heat sink. The intermediate member(20) is fixed by the melting of the metal adhesion material to the guide groove. The intermediate member has the coefficient of thermal expansion which is similar to the coefficient of thermal expansion of the emitting device(30). The light emitting device is fixed to the intermediate member by the melting of the metal adhesion material. The combining aperture passes perpendicularly though the heat sink. The cylinder isolator(40a) is inserted in the combining aperture. The terminal pin(41) is combined in the cylinderical isolator and is connected to the light emitting device with the wire(43). The terminal pin(42) is fixed to the bottom surface of the heat sink by welding. |
