| 发明名称 |
A MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES |
| 摘要 |
PURPOSE: A manufacturing method of semiconductor devices is provided to suppress bending of a substrate after molding by forming a substrate sheet material as a circle. CONSTITUTION: In a device, a plurality of substrates(11) are formed in a semiconductor package by using circular substrate sheet material(10). A semiconductor chip is mounted in each substrate. The semiconductor package is formed after molding the semiconductor chip, the semiconductor package is separated individually. |
| 申请公布号 |
KR20090127860(A) |
申请公布日期 |
2009.12.14 |
| 申请号 |
KR20090112757 |
申请日期 |
2009.11.20 |
| 申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
MEGURO KOUICHI;NISHINO TORU;HAYASAKA NOBORU |
| 分类号 |
H01L21/56;H01L21/48;H01L23/31 |
主分类号 |
H01L21/56 |
| 代理机构 |
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