A PRINTED CIRCUIT BOARD AND A METHOD FOR MANUFACTURING THE SAME
摘要
<p>PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a bump with a fine pitch using a conductive paste including a carbon nano tube and a photosensitive binder. CONSTITUTION: A circuit board main body(10) has a circuit layer conducting an electric signal. A bump(35) is made of a carbon nano tube electrically connected to a circuit layer and a conductive paste including a photosensitive binder. The circuit board main body includes an external connection terminal exposed to the outermost circuit layer. The outermost circuit layer includes an external connection terminal connected to the electronic components. A solder resist layer(13) is coated in the part except the external connection terminal to prevent the corrosion and etching of the outermost circuit layer. The conductive paste includes the metal powder.</p>
申请公布号
KR20090127605(A)
申请公布日期
2009.12.14
申请号
KR20080053667
申请日期
2008.06.09
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
MOK, JEE SOO;YOO, JE GWANG;LEE, EUNG SUEK;RYU, CHANG SUP