ELECTRONIC DEVICE WAFER MODULE AND ITS PRODUCTION PROCESS, ELECTRONIC DEVICE MODULE, ELECTRONIC INFORMATION EQUIPMENT

摘要

<P>PROBLEM TO BE SOLVED: To easily and exactly detect (alignment) superposition of a cover glass and a semiconductor wafer. Ž<P>SOLUTION: A transparent glass substrate 24 to cover and protect each solid image pickup device 21 is joined to a semiconductor substrate 22 of an electronic device wafer on which the solid image pickup devices 21 are formed. On at least one surface of this transparent glass substrate 24, an infrared cut filter substrate 25 and an optical low pass filter 26 as optical filters are formed corresponding to the each solid image pickup device 21. Part of or the whole lines of the optical filter along dicing lines D to make a plurality of electronic device modules 2 into individual pieces are removed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž