| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning method and a cleaning device that prevent the device from becoming huge excessively even in the case of a silicon wafer having an increased aperture, also reduce the amount of used chemical with respect to the aperture. Ž<P>SOLUTION: In the cleaning method of a silicon wafer, the silicon wafer is floated and moved in a cleaning liquid by a stream of water blown out from a lower portion to an upper oblique portion for cleaning during movement. In the silicon wafer cleaning device, a cleaning tank and a plurality of supply openings provided at the bottom of the cleaning tank for blowing out a stream of water in the direction of travel of the silicon wafer are arranged at least in a row in the travelling direction of the silicon wafer, and the silicon wafer is floated and moved from the inlet side to the outlet side of the silicon wafer for cleaning. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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