发明名称 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition desirable for the production of a film being excellent in slip characteristics while keeping necessary transparency and to provide a polyimide film being excellent in slip characteristics and transparency and prepared by melt-extruding the composition. Ž<P>SOLUTION: Provided is a polyamide resin composition compounded from the following components (A) to (D): (A) 100 pts.wt. polyamide resin, (B) 0.05-1 pt.wt. silica particles, (C) 0.01-1.0 pt.wt. bisamide compound represented by the general formula: R<SP>1</SP>-CONH(CH<SB>2</SB>)<SB>2</SB>NHCO-R<SP>2</SP>(wherein R<SP>1</SP>and R<SP>2</SP>are each 12-32C hydrocarbon group, provided that R<SP>1</SP>and R<SP>2</SP>may be the same or different from each other), and (D) 0.01-0.12 pt.wt. alkaline earth metal oxide or hydroxide. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009286921(A) 申请公布日期 2009.12.10
申请号 JP20080141876 申请日期 2008.05.30
申请人 TORAY IND INC 发明人 TACHIBANA YASUHITO;IWAMURA NAOYA;ARAI TAKASHI
分类号 C08L77/00;C08K3/22;C08K3/36;C08K5/20 主分类号 C08L77/00
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