| 发明名称 |
Support plate, carrier device, releasing device, and releasing method |
| 摘要 |
A support plate for supporting a wafer includes a plurality of through holes piercing the support plate in the thickness direction, and a belt-shaped or island-like flat portion on which the plurality of through holes are not formed.
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| 申请公布号 |
US2009305617(A1) |
申请公布日期 |
2009.12.10 |
| 申请号 |
US20070309287 |
申请日期 |
2007.04.17 |
| 申请人 |
TOKYO OHKA KOGYO CO., LTD |
发明人 |
NAKAMURA AKIHIRO;MIYANARI ATSUSHI;INAO YOSHIHIRO |
| 分类号 |
H01L21/683;B25B11/00;B29C43/50;H01L21/02 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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