发明名称 Polyamide Resin Composition for Laser Marking and Laser-Marked Polyamide Resin Molded Product
摘要 There is provided a polyamide resin composition capable of not only maintaining inherent properties of polyamide resins including moldability, mechanical properties, thermal stability, heat resistance and electrical properties but also exhibiting a good flame retardance and an excellent laser marking property, as well as a resin molded product for laser marking which is molded from the composition. The polyamide resin composition for laser marking according to the present invention includes 100 parts by weight of a polyamide resin and 0.1 to 100 parts by weight of a halogen-containing organic compound and/or an antimony compound, wherein when subjecting a molded product obtained from the composition to laser marking, a color tone of a laser-marked portion of the molded product exhibits a darker color than that of a surface of a laser-non-irradiated portion of the molded product.
申请公布号 US2009306262(A1) 申请公布日期 2009.12.10
申请号 US20060990271 申请日期 2006.08.11
申请人 TSUNODA MORIO;YAMANAKA YASUSHI;SUZUKI MASAMI 发明人 TSUNODA MORIO;YAMANAKA YASUSHI;SUZUKI MASAMI
分类号 C08K5/06;C08K3/10 主分类号 C08K5/06
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