发明名称 |
Method and Apparatus for Thermally Enhanced Semiconductor Package |
摘要 |
A semiconductor package includes a semiconductor die. Encapsulant is flowed around a portion of the semiconductor die. The encapsulant is etched and a conductive material is deposited into the etched portion of the encapsulant to form a thermally conductive structure. In one embodiment, a trench is etched into the encapsulant and a thermally conductive material is deposited into the trench to form a thermal channel. In alternative embodiments, thermally conductive through hole vias (THVs) are formed in the encapsulant. A thermally conductive pad may be formed over the semiconductor die to facilitate removal of heat energy from the hot spots of the semiconductor die. A thermally conductive trace is formed to interconnect the thermal channel and the thermally conductive pad. A heat sink may be deposited over the semiconductor package. The packages are singulated by cutting through the encapsulant or the thermal channel.
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申请公布号 |
US2009302445(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20080135830 |
申请日期 |
2008.06.09 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
PAGAILA REZA A.;DO BYUNG TAI;CAMACHO ZIGMUND R. |
分类号 |
H01L23/02;H01L21/00;H01L23/28 |
主分类号 |
H01L23/02 |
代理机构 |
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地址 |
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