| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device which can prevent the reliability reduction of not only its semiconductor light-emitting element but also its package, wherein this semiconductor light-emitting element is installed. SOLUTION: The semiconductor light emitting device includes a semiconductor laser element 2, each transparent material layer 12, whose surface contacts with each outgoing end surface of the semiconductor laser element partially and which transfers each laser light made to outgo from the semiconductor laser element, and each transparent liquid polymer 13, provided in the clearance between each outgoing end surface of the semiconductor laser element and each transparent material layer. COPYRIGHT: (C)2010,JPO&INPIT |
