| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive package for housing a light emitting element, which does not impede light emission from a light emitting element and effectively dissipates heat generated therefrom. <P>SOLUTION: The package 10 for housing the light emitting element, including a reflector 14 enclosing the light emitting element 12 mounted on the upper surface of a ceramic substrate 11 to reflect light therefrom, and a heat sink 16 for dissipating the heat from the light emitting element 12 on a lower surface, has a plurality of through-holes 17 in the ceramic substrate 11 at outside peripheral parts of the reflector 14, caulking pins 18 which are erected on the heat sink 16 and are inserted into the through-holes 17, and insertion holes 19 into which tip ends thereof are inserted from the upper surface of the heat sink 16. The caulking pins 18 are inserted into the through-holes 17 to bring the ceramic substrate 11 into contact with the upper part of the heat sink 16, and bent to be led out of the ceramic substrate 11, and the tip ends are pressed into the insertion holes 19 to join the ceramic substrate 11 onto the heat sink 16 by caulking. <P>COPYRIGHT: (C)2010,JPO&INPIT |
