ELECTRONIC COMPONENT MOUNTING BOARD, AND MANUFACTURING METHOD THEREOF

摘要

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting board allowing an underfill to be uniformly filled in the entire undersurface of an electronic component; and a manufacturing method of the electronic component mounting board. Ž<P>SOLUTION: This electronic component mounting board 1 is provided with a circuit board 10 and the electronic component 20 mounted on the circuit board 10, and allows the underfill 30 to be injected into a space formed between a mounting surface 11 of the circuit board 10 with the electronic component 20 mounted thereon and the electronic component 20. An injection hole 13 for injecting the underfill 30 therethrough is formed in a part of the circuit board 10 facing the electronic component 20 by penetrating in the thickness direction of the circuit board 10; and restriction parts 14 restricting the flow of the injected underfill 30 on the mounting surface 11 are formed in the vicinities of the periphery of the injection hole 13 of the mounting surface 11. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž