| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor mounting substrate that efficiently dissipates heat generated by semiconductor devices mounted on the substrate through heat sinks. <P>SOLUTION: The semiconductor mounting substrate includes a mounting substrate 1 having through-holes 3 formed at a region where the semiconductor devices are mounted, and the heat sinks 5 built into the opposite surface side from the semiconductor mounting surface by fitting projections 4 in the through-holes 3 to abut directly or indirectly on the semiconductor devices, the heat sinks 5 being held integrally with the mounting substrate 1 while having flat plate portions 5a exposed and outer peripheries sealed with sealing resins 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
