| 摘要 |
A thermoelectric module device absorbs heat from the hot side, and transfers the heat to the cold side; the thermoelectric module device is constituted by a heat sink on the hot side, another heat sink on the cold side and a series of Peltier elements, and the series of Peltier elements is formed from pairs of semiconductor elements of different conductivity types, endoergic metal electrodes and exoergic metal electrodes; since the entire major surfaces of heat sinks are not available for the endoergic metal electrodes and exoergic metal electrodes due to fitting holes and vapor-proof sealing walls, the ratio of area occupied with the metal electrodes to available area and the ratio of area not available for the metal electrodes to entire major surface are not less than 50% and not greater than 20%.
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