发明名称 IMPROVED MULTILAYER ELECTROSTATIC CHUCK WAFER PLATEN
摘要 This layered assembly utilizes two-piece construction, with an electrically nonconductive layer and a thermally conductive layer. Rather than using metal, the thermally conductive layer is made from a composite material, having both metal and a CTE modifying agent. This composite material may a coefficient of thermal expansion close to or identical to that of the nonconductive layer, thereby eliminating many of the drawbacks of the prior art. In one embodiment, the composite material is a mixture of aluminum and carbon (or graphite) fiber. In a further embodiment, one or more fluid conduits are placed in the mold before the layer is cast These conduits serve as the fluid passageways in the electrostatic chuck. In another embodiment, the composite material is a mixture of a semiconductor material, such as silicon, and aluminum where the conduits are formed by machining and bonding.
申请公布号 WO2009149275(A2) 申请公布日期 2009.12.10
申请号 WO2009US46283 申请日期 2009.06.04
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES;FISH, ROGER, B. 发明人 FISH, ROGER, B.
分类号 H01L21/683;H01L21/265;H01L21/687 主分类号 H01L21/683
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