| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing condensation from arising on an inner wall of the semiconductor device, especially on an inside surface of a transparent substrate, while being able to certainly prevent dust from flowing in the semiconductor device. <P>SOLUTION: A semiconductor device 1 is equipped with: a semiconductor substrate loading semiconductor elements with a light-receiving part for receiving light; a transparent substrate with optical transparency which is arranged so as to oppose an upper side of the semiconductor substrate through a gap; and a spacer 4 which is located between the semiconductor substrate and the transparent substrate and makes a frame shape regulating a gap distance between the semiconductor substrate and the transparent substrate, wherein an internal space 11 surrounded by the semiconductor substrate, the transparent substrate and the spacer 4 is airtightly sealed. In the spacer 4 thin parts 43a to 43d are formed. The water vapor permeability of each of the thin parts 43a to 43d of the spacer 4 is larger than that of a thick part 45 of the spacer 4. The transmission of water vapor G between the internal space 11 and the outside is preferentially performed through each of the thin parts 43a to 43d. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
