| 摘要 |
PROBLEM TO BE SOLVED: To provide single wafer vacuum heat press equipment excellent in production efficiency and energy utilization efficiency for manufacturing a multilayered circuit board, and vacuum heat press equipment capable of manufacturing a highly precise multilayered circuit board with high yield. SOLUTION: The vacuum heat press equipment 200 is constituted by being provided with: a first pressurization heating unit HU1 which pressurizes and heats a work 40a from the outside; a second pressurization heating unit HU2 which pressurizes and heats the work 40a processed by the first pressurization heating unit HU1 from the outside; and a pressurization cooling unit CU which pressurizes and cools the work 40a processed by the second pressurization heating unit HU2 from the outside, constituted by arranging the respective units HU1, HU2, CU on the circumference, and the work 40a is conveyed to the respective processing positions of the respective units HU1, HU2, CU by a revolution mechanism RM arranged at the center of the circumference. COPYRIGHT: (C)2010,JPO&INPIT |
