发明名称 Patterning metal layers
摘要 A process for fabricating an electronic device comprising the step of patterning a metallic electrode to the electronic device by laser ablation followed by electroless plating, wherein the process of fabricating the electronic device comprises at least one other laser patterning step over the area of the metallic electrode performed after said step of patterning the metallic electrode.
申请公布号 US7629261(B2) 申请公布日期 2009.12.08
申请号 US20060910813 申请日期 2006.04.04
申请人 PLASTIC LOGIC LIMITED 发明人 CAIN PAUL A.
分类号 H01L21/302;H01L21/461;H01L51/00;H01L51/05;H01L51/10 主分类号 H01L21/302
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