LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An LED package and method of manufacturing the same are provided to minimize the size of the light source and to mount the LED chip within the cavity. CONSTITUTION: The radiating unit(100) is composed of the metal layer more than two layers and the cavity(105) is formed. The first lead(110) is formed extendly to one side of the heat sink. The second lead(120) is separated from the radiating unit. The mold(130) fixes the radiating unit, the first lead and the second lead. The LED chip(140) is mounted within the cavity. The first filler is filled within the cavity in order to protect the LED chip.