| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means with no need to enlarge the electrode of a semiconductor device when stitch bonding is performed on the second electrode of a semiconductor device fixed to a substrate. <P>SOLUTION: The wire bonding method where stitch bonding of a wire 6 is performed on the second electrode 10 by performing ball bonding of the wire 6 on a first electrode 9 formed on the surface of a substrate 11 with a capillary and then moving the capillary to a second rectangular electrode 10 formed on the surface of a semiconductor device 12 fixed onto the surface of the substrate 11 while the wire 6 is being fed out from the capillary. The capillary is designed to be moved on a straight line 18 connecting substantially the center 5 of a mark 4 of the capillary marked on the electrode 9 formed on the surface of the substrate 11 with one corner 17 of the electrode 10 at the stitch bonding viewed from the thickness direction of the substrate 11 is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
