发明名称 CAPACITIVE SENSOR WITH STRESS RELIEF THAT COMPENSATES FOR PACKAGE STRESS
摘要 A microelectromechanical systems (MEMS) capacitive sensor (52) includes a movable element (56) pivotable about a rotational axis (68) offset between ends (80, 84) thereof. A static conductive layer (58) is spaced away from the movable element (56) and includes electrode elements (62, 64). The movable element (56) includes a section (74) between the rotational axis (68) and one end (80) that exhibits a length (78). The movable element (56) further includes a section (76) between the rotational axis (68) and the other end (84) that exhibits a length (82) that is less than the length (78) of the section (74). The section (74) includes slots (88) extending through movable element (56) from the end (80) toward the rotational axis (68). The slots (88) provide stress relief in section (74) that compensates for package stress to improve sensor performance.
申请公布号 WO2009145963(A1) 申请公布日期 2009.12.03
申请号 WO2009US36755 申请日期 2009.03.11
申请人 FREESCALE SEMICONDUCTOR INC.;LIN, YIZHEN;MCNEIL, ANDREW, C. 发明人 LIN, YIZHEN;MCNEIL, ANDREW, C.
分类号 B81B3/00;B81B7/00;B81C1/00;G01L1/14;H01L29/84 主分类号 B81B3/00
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