<p>PURPOSE: A forming apparatus for transistor lead-wire is provided to reduce the foaming process time and enhance the productivity of product. CONSTITUTION: The base frame(110) has the internal space. The main case(120) comprises the cover plate, interplate and bottom plate. The upper mold cylinder(131) is fixed and combined in the cover plate. The low die cylinder(132) is located on surface the same shaft as the upper mold cylinder. The cutting-cylinders(140) cut the end of the lead wire of the formed transistor. The transistor exhausting part exhausts the formed transistor through the foaming mold.</p>
