| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device whose heat dissipation properties can be enhanced while enabling simplification of the production method and suppression of deterioration in luminescence characteristics. <P>SOLUTION: A surface-mounting LED (a light-emitting device) 100 comprises a substrate 1 of a metal plate including a first portion 2, and a second portion 3 separated from the first portion 2, an LED device 20 fixed on the first portion 2 of the substrate 1 and electrically connected with the first portion 2 and second portion 3 of the substrate 1, respectively, a reflective frame 10 consisting of aluminum or an aluminum alloy where the inner side surface 13a of an opening 13 serves as a reflective surface for reflecting light from the LED device 20, and a translucent member 30 for sealing the LED device 20. The reflective frame 10 is fixed on the substrate 1 with an adhesive layer 40 consisting of a material different from the translucent member 30 interposed therebetween so that the reflective frame 10 comes into thermal contact with at least the first portion 2 of the substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
