发明名称 |
Leadframe mit einem nichtleitenden Verbindungssteg |
摘要 |
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame. |
申请公布号 |
DE112006003788(T5) |
申请公布日期 |
2009.12.03 |
申请号 |
DE20061103788T |
申请日期 |
2006.03.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HAGEN, ROBERT-CHRISTIAN;HARUN, FUAIDA;HENG, YANG HONG;LEE, KEAN CHEONG;TONG, SOON HOCK;WEE, BENG TATT ALVIN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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