| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method by which an operator can select defects having the possibility of exerting a fatal influence upon the operation of an integrated circuit from many pieces of defect data of a wafer surface by his or her easy operation so as to display defect images of the selected defects. <P>SOLUTION: In the surface defect data display management device 3, a risk level calculation part 33 calculates an influence degree of a defect upon yield of the final product on the basis of a defect size of the wafer detected by an appearance inspection device 12 and a review device 10 and a pattern density obtained from design data of a pattern figure corresponding to neighbors of the position of the defect. A correlation graph and defect image display part 38 generates a correlation graph representing correlation between defect sizes and risk levels of respective defects and displays the correlation graph on a display device 40 and furthermore displays a defect image list of one or more defects selected using the correlation graph. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
