发明名称 CONNECTION STRUCTURE BETWEEN LEAD WIRE AND WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a connection structure that simply and surely connects a lead wire of a speaker or the like with a wiring board without using a connector. Ž<P>SOLUTION: The ends of lead wires 2a and 2b are soldered to lead wire soldering lands 5d and 5e of first and second pattern lands 5b and 5c of a split substrate 5, and third and fourth pattern lands 4b and 4c are provided at the chip end of a conducting pattern that is covered with a resist on the lower surface of a wiring board 4. The split substrate 5 is interposed in a wiring board supporting part 3a and the wiring board 4 is placed thereon, and they are co-tightened and fixed with a screw 6. The first pattern land 5b and the third pattern land 4b and the second pattern land 5c and the fourth pattern land 4c are press-fitted respectively, resulting in a connection structure. The split substrate 5 is adopted instead of a connector, so that cost can be reduced, and poor connection or the like can be also eliminated thanks to co-tightening and fixation. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009283613(A) 申请公布日期 2009.12.03
申请号 JP20080133067 申请日期 2008.05.21
申请人 FUNAI ELECTRIC CO LTD 发明人 MIZUNUMA YU
分类号 H05K3/34;H01R4/38;H04R1/06;H05K1/14 主分类号 H05K3/34
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